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4611 Datasheet(PDF) 8 Page - 3M Electronics |
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4611 Datasheet(HTML) 8 Page - 3M Electronics |
8 / 10 page - 8 - Design and Tape Selection Considerations Choose the right tape for the substrate: Adhesives must flow onto the substrate surfaces in order to achieve intimate contact area and allow the molecular force of attraction to develop. The degree of flow of the adhesive on the substrate is largely determined by the surface energy of the substrate. 3M™ VHB™ Tapes Use the right tape thickness: The necessary thickness of tape depends on the rigidity of substrates and their flatness irregularity. While the 3M™ VHB™ Tapes will conform to a certain amount of irregularity, they will not flow to fill gaps between the materials. For bonding rigid materials with normal flatness, consider use of tapes with thickness of 45 mils (1.1 mm) or greater. As the substrate flexibility increases thinner tapes can be considered. Use the right amount of tape: Because 3M™ VHB™ Tapes are viscoelastic by nature their strength and stiffness is a function of the rate at which they are stressed. They behave stronger with relatively faster rate of stress load (dynamic stresses) and will tend to show creep behavior with stress load acting over a long period of time (static stresses). As a general rule, for static loads, approximately four square inches of tape should be used for each pound of weight to be supported in order to prevent excessive creep. For dynamic loads, the dynamic performance characteristics provided on page 4 should be useful, factoring in the appropriate safety factors. Allow for thermal expansion/contraction: 3M™ VHB™ Tapes can perform well in applications where two bonded surfaces may expand and contract differentially. Assuming good adhesion to the substrates, the tapes can typically tolerate differential movement in the shear plane up to 3 times their thickness. Bond Flexibility: While an advantage for many applications where allowing differential movement is a benefit, the tape bonds are typically more flexible than alternative bonding methods. Suitable design modifications or periodic use of rigid fasteners or adhesives may be needed if additional stiffness is required. Severe Cold Temperature: Applications which require performance at severe cold temperatures must be thoroughly evaluated by the user if the intended use will subject the tape product to high impact stresses. A technical bulletin “3M™ VHB™ Tape Cold Temperature Performance” (70-0707-3991-0) is available for additional information. Adhesive High surface energy — Substrate Adhesive Low surface energy — Substrate This illustration demonstrates the effect of surface energy on adhesive interfacial contact. High surface energy materials draw the adhesive closer for high bond strength. Relationship of Adhesion and Surface Energy for 3M™ VHB™ Tape Adhesive Families 400-1100 Aluminum Stainless Steel Copper Zinc Tin Lead Anodized Aluminum Glass 42-50 Kapton® Phenolic Nylon Alkyd Enamel Polyester Epoxy Paint Polyurethane 36-37 PVA Polystyrene Acetal Kynar® Paint Powder Paint 18-33 EVA Polyethylene Polypropylene Tedlar® Silicone PTFE NOTES: There are a wide variety of formulations, surfaces finishes and surface treatments available on substrate materials which can affect adhesion. This chart is intended to provide only a rough estimate of the adhesion levels which can be expected on some common materials relative to a reference surface such as aluminum. Light abrasion of surface will significantly increase adhesion levels on many materials, except when using tapes 4952/4932. 38-39 ABS Polycarbonate (Lexan®) PVC Noryl® Acrylic Polane® Paint Powder Paint 100% 50% 0% HIGH LOW MEDIUM Surface Energy (Dynes/cm) Multi-Purpose Adhesive General Purpose Adhesive Low T emperature Adhesive NOTE: Low surface energy adhesive may be less affected by surface energy. NOTE: Foam type can affect and/or limit maximum adheisve strength. |
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