Document Number: 30179

www.vishay.com

Revision: 26-Jan-11

2

WSLP2726

Low Value (Down to 0.0005

), Surface Mount

Vishay Dale

DIMENSIONS

DERATING

Note

• Embossed carrier tape per EIA-481.

MODEL

DIMENSIONS in inches (millimeters)

LW

H

R

S

T

U

WSLP2726

0.272 ± 0.008

(6.9 ± 0.2)

0.260 + 0.012/- 0.008

(6.6 + 0.3/- 0.2)

0.117 ± 0.008

(3.0 ± 0.2)

0.193 ± 0.004

(4.9 ± 0.1)

0.028 ± 0.004

(0.7 ± 0.1)

0.016 ± 0.002

(0.4 ± 0.05)

0.078 ± 0.004

(2.0 ± 0.1)

b

w

d

a

b

c

L

W

S

R

H

T

U

MODEL

SOLDER PAD DIMENSIONS in inches (millimeters)

abcd

w

WSLP2726

0.220

(5.6)

0.096

(2.44)

0.035

(0.89)

0.035

(0.89)

0.290

(7.4)

MODEL

RESISTANCE VALUE

(m

)

ELEMENT MATERIAL

WSLP2726

0.5

Mn-Cu

WSLP2726

1.0

Mn-Cu

WSLP2726

2.0

Ni-Cr

70

120

100

80

60

40

20

0

170

150

125

100

75

50

25

0

- 25

- 50

- 65

Ambient Temperature in °C

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

Thermal shock

- 55 °C to + 150 °C, 1000 cycles, 15 min at each extreme

± (0.5 % + 0.0005

) R

Short time overload

5 x rated power for 5 s

± (0.5 % + 0.0005

) R

Low temperature operation

- 65 °C for 45 min

± (0.5 % + 0.0005

) R

High temperature exposure

1000 h at + 170 °C

± (1.0 % + 0.0005

) R

Bias humidity

+ 85 °C, 85 % RH, 10 % bias, 1000 h

± (0.5 % + 0.0005

) R

Mechanical shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.0005

) R

Vibration

Frequency varied 10 Hz to 2000 Hz in 1 min, 3 directions, 12 h

± (0.5 % + 0.0005

) R

Load life

1000 h at + 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± (1.0 % + 0.0005

) R

Resistance to solder heat

+ 260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.0005

) R

Moisture resistance

MIL-STD-202, method 106, 0 % power, 7b not required

± (0.5 % + 0.0005

) R

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSLP2726

16 mm/embossed plastic

330 mm/13"

1500

EA