Electronic Components Datasheet Search |
|
SFC05-4 Datasheet(PDF) 4 Page - Semtech Corporation |
|
SFC05-4 Datasheet(HTML) 4 Page - Semtech Corporation |
4 / 7 page 4 ã 2000 Semtech Corp. www.semtech.com PRELIMINARY PROTECTION PRODUCTS SFC05-4 PRELIMINARY Device Connection Options The SFC05-4 has solder bumps located in a 3 x 2 matrix layout on the active side of the device. The bumps are designated by the numbers 1 - 3 along the horizontal axis and letters A - B along the vertical axis. The lines to be protected are connected at bumps A1, B1, A3, and B3. Bumps A2 & B2 are connected to ground. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Wafer Level CSP TVS CSP TVS devices are wafer level chip scale packages. They eliminate external plastic packages and leads and thus result in a significant board space savings. Manu- facturing costs are minimized since they do not require an intermediate level interconnect or interposer layer for reliable operation. They are compatible with cur- rent pick and place equipment further reducing manu- facturing costs. Certain precautions and design considerations have to be observed however for maximum solder joint reliability. These include solder pad definition, board finish, and assembly parameters. Printed Circuit Board Mounting Non-solder mask defined (NSMD) land patterns are recommended for mounting the SFC05-4. Solder mask defined (SMD) pads produce stress points near the solder mask on the PCB side that can result in solder joint cracking when exposed to extreme fatigue conditions. The recommended pad size is 0.200 ± 10 mm with a solder mask opening of 0.350 ± 0.025 mm. Grid Courtyard The recommended grid placement courtyard is 1.3 x 1.8 mm. The grid courtyard is intended to encompass the land pattern and the component body that is centered in the land pattern. When placing parts on a PCB, the highest recommended density is when one courtyard touches another. Applications Information Device Schematic & Pin Configuration Layout Example NSMD Package Footprint A B 1 23 To Protected IC To Protected IC To Connector Ground |
Similar Part No. - SFC05-4 |
|
Similar Description - SFC05-4 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |