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PCF8523TK-1 Datasheet(PDF) 2 Page - NXP Semiconductors |
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PCF8523TK-1 Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 66 page PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 30 March 2011 2 of 66 NXP Semiconductors PCF8523 Real-Time Clock (RTC) and calendar 4. Ordering information [1] Delivery form: sawn 6-inch wafer (see Figure 41 on page 57) with gold bumps on Film Frame Carrier (FFC) for 8-inch wafer (see Figure 42 on page 57). 5. Marking Table 1. Ordering information Type number Package Name Description Version PCF8523T/1 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 PCF8523TS/1 TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 PCF8523TK/1 HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 4 0.85 mm SOT909-1 PCF8523U/12AA/1 PCF8523U bare die; 12 bumps (6-6)[1] PCF8523U Table 2. Marking codes Type number Marking code PCF8523T/1 8523T PCF8523TS/1 8523TS PCF8523TK/1 8523 PCF8523U/12AA/1 PC8523-1 |
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