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MAX13301 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX13301 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 37 page 4-Channel, Automotive Class D Audio Amplifier 2 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PVDD to PGND......................................................-0.3V to +30V PVDD to PGND (t < 200ms)..................................-0.3V to +50V PVDD Ramp Rate ........................................................... 25V/ms VDD5, CM to PGND.................................................-0.3V to +6V CP to PGND ........................(VPVDD - 0.3V) to (VCHOLD + 0.3V) CHOLD to PVDD .....................................................-0.3V to +6V OUT_ to PGND, FB_ to PGND ..............-0.3V to (VPVDD + 0.3V) VDD to GND............................................................-0.3V to +6V REF to GND.............................................................-0.3V to +6V SCL, SDA, SYNC to GND........................................-0.3V to +6V MUTE_CL1, CL0, FLT_OT, EN to GND...................-0.3V to +6V IN_ to GND..............................................................-0.3V to +6V GND to PGND ......................................................-0.3V to +0.3V Continuous Power Dissipation (Notes 1 and 2) TSSOP (derate 16.7mW/NC above 70NC)...............1333.3mW Operating Temperature Range........................ -40NC to +125NC Junction Temperature Range........................... -40NC to +150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+240NC TSSOP Junction-to-Ambient Thermal Resistance (BJA) ..........60NC/W Junction-to-Case Thermal Resistance (BJC) .................1NC/W ELECTRICAL_CHARACTERISTICS (VPVDD = 14.4V, VDD = VDD5 = 5V, VGND = VPGND = 0V, fSW = 500kHz, MAP.COMP[2:0] = (see Table 20 for applicable setting), TA = -40NC to +125NC; typical values are at TA = +25NC, unless otherwise noted.) (Note 3) ABSOLUTE_MAXIMUM_RATINGS PACKAGE_THERMAL_CHARACTERISTICS_(Notes_1_and_2) Note_1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note_2: The 48-pin TSSOP-EPR package has a top side exposed pad for enhanced thermal management. Connect this exposed pad to an external heatsink to ensure the device is adequately cooled. The maximum power dissipation in the device is a function of this external heatsink and other system parameters. See the Thermal Information section for more information. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS AMPLIFIER_DC_CHARACTERISTICS Supply Voltage Range VPVDD 8 25.5 V Operational 6 VDD5 4.75 5 5.5 VDD 4.5 5 5.5 PVDD UVLO Threshold Falling 5.2 5.35 5.6 V PVDD OVLO Threshold Rising 26 27 30 V PVDD OVLO Response Timing Rising 4 14 55 F s OUT_ and FB_ Voltage OV active VPVDD/2 V VDD UV Threshold Falling 4.2 4.35 V Rising 4.5 4.6 VDD UV Threshold Hysteresis 0.1 0.2 V VDD UV Threshold Deglitch 1 F s Quiescent Supply Current IPVDD RL = J , play mode (CTRL2 = 0x0F) 70 F A IVDD5 60 72 mA IVDD 50 75 |
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