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MAX3206EEBL Datasheet(PDF) 5 Page - Maxim Integrated Products |
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MAX3206EEBL Datasheet(HTML) 5 Page - Maxim Integrated Products |
5 / 9 page Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces _______________________________________________________________________________________ 5 During an ESD event, the current pulse rises from zero to peak value in nanoseconds (Figure 3). For example, in a 15kV IEC-61000 Air-Gap Discharge ESD event, the pulse current rises to approximately 45A in 1ns (di/dt = 45 x 109). An inductance of only 10nH adds an additional 450V to the clamp voltage. An inductance of 10nH represents approximately 0.5in of board trace. Regardless of the device’s specified diode clamp volt- age, a poor layout with parasitic inductance significantly increases the effective clamp voltage at the protected signal line. A low-ESR 0.1µF capacitor must be used between VCC and GND. This bypass capacitor absorbs the charge transferred by an +8kV IEC-61000 Contact Discharge ESD event. Ideally, the supply rail (VCC) would absorb the charge caused by a positive ESD strike without changing its regulated value. In reality, all power supplies have an effective output impedance on their positive rails. If a power supply’s effective output impedance is 1 Ω, then by using V = I × R, the clamping voltage of VC increas- es by the equation VC = IESD x ROUT. An +8kV IEC 61000-4-2 ESD event generates a current spike of 24A, so the clamping voltage increases by VC = 24A × 1Ω, or VC = 24V. Again, a poor layout without proper bypassing increases the clamping voltage. A ceramic chip capacitor mounted as close to the MAX3202E/ MAX3203E/MAX3204E/MAX3206E VCC pin is the best choice for this application. A bypass capacitor should also be placed as close to the protected device as possible. ±15kV ESD Protection ESD protection can be tested in various ways; the MAX3202E/MAX3203E/MAX3204E/MAX3206E are characterized for protection to the following limits: • ±15kV using the Human Body Model • ±8kV using the Contact Discharge method speci- fied in IEC 61000-4-2 • ±15kV using the IEC 61000-4-2 Air-Gap Discharge method ESD Test Conditions ESD performance depends on a number of conditions. Contact Maxim for a reliability report that documents test setup, methodology, and results. Human Body Model Figure 4 shows the Human Body Model, and Figure 5 shows the current waveform it generates when dis- charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter- est, which is then discharged into the device through a 1.5k Ω resistor. CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 100pF RC 1M Ω RD 1.5k Ω HIGH- VOLTAGE DC SOURCE DEVICE UNDER TEST Figure 4. Human Body ESD Test Model IP 100% 90% 36.8% tRL TIME tDL CURRENT WAVEFORM PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Ir 10% 0 0 AMPERES Figure 5. Human Body Model Current Waveform tR = 0.7ns to 1ns 30ns 60ns t 100% 90% 10% I Figure 3. IEC 61000-4-2 ESD Generator Current Waveform |
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