Document #: 38-05447 Rev. *L

Page 5 of 16

Thermal Resistance

Parameter[11]

Description

Test Conditions

VFBGA

(6 × 8 × 1mm)

Unit



JA

Thermal resistance

(Junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board

55

C/W



JC

Thermal resistance

(Junction to case)

16

C/W

Figure 2. AC Test Loads and Waveforms

Parameters

1.8 V

Unit

R1

13500



R2

10800



6000



0.80

V

Data Retention Characteristics

Over the Operating Range

Parameter

Description

Conditions

Min

Typ[12]

Max

Unit

1.0

–

–

V

[13]

Data retention current

––

10

A

[11]

Chip deselect to data

retention time

0–

–

ns

[14]

Operation recovery time

55

–

–

ns

Figure 3. Data Retention Waveform

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1

Notes

11. Tested initially and after any design or process changes that may affect these parameters.

15. BHE. BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.

DATA RETENTION MODE

BHE

or

[15]