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FTR-K1 SERIES

1. General Information

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AllsignalandpowerrelaysproducedbyFujitsuComponentsarecompliantwithRoHSdirective2002/95ECincluding

amendments.

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CadmiumasusedinelectricalcontactsisexemptedfromtheRoHSdirectivesonOctober21st,2005.

(AmendmenttoDirective2002/95/EC)

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Allofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfoforolderdatecodes

at:http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf

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LeadfreesolderplatingonrelayterminalsisSn-3.0Ag-0.5Cu,unlessotherwisespecified.

ThismaterialhasbeenverifiedtobecompatiblewithPbSnassemblyprocess.

2. Recommended Lead Free Solder Profile

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Recommended solder Sn-3.0Ag-0.5Cu.

RoHS Compliance and Lead Free Information

3. Moisture Sensitivity

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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrelays,unlessotherwiseindicated.

4. Tin Whiskers

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DippedSnAgCusolderisknownaspresentingalowrisktotinwhiskerdevelopment.Noconsiderablelength

whiskerwasfoundbyourinhousetest.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum120˚C

Soldering:

dipwithin5sec.at

260˚Csolderbath

JSL SERIES

Solder by Soldering Iron:

Soldering Iron

Temperature:

maximum360˚C

Duration:

maximum3sec.