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SSL1005M-R12MF-R39 Datasheet(PDF) 4 Page - Superworld Electronics |
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SSL1005M-R12MF-R39 Datasheet(HTML) 4 Page - Superworld Electronics |
4 / 7 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 08.04.2011 7. RELIABILITY AND TEST CONDITION : PERFORMANCE should be covered with solder. More than 90% of the terminal electrode Refer to standard electrical characteristics list 60 seconds 60 seconds Preheating 1. Appearance : No significant abnormality 2. Inductance change : Within ± 20% of initial value Preheating No disconnection or short circuit. 2. Inductance : Within ± 20% of initial value. 1. Appearance : No damage No disconnection or short circuit. 2. Inductance : Within ± 20% of initial value. 1. Appearance : No damage Reliability Test Humidity Resistance Life Test Life Test High Temperature Low Temperature Thermal Shock Solderability Test Solder Heat Resistance 150° C 260° C 150° C 245° C Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Electrical Characteristics Test ITEM Temperature : 40± 5° C Time : 500± 12 hours Applied Current : Rated Current Humidity : 90% to 95% Recovery : 4 to 24hrs of recovery under the standard Recovery : 4 to 24hrs of recovery under the standard Temperature : 125± 5° C Temperature : -40± 5° C Time : 500± 12 hours Time : 500± 12 hours -25± 3 85± 3 Conditions of 1 cycle. Room Temperature Room Temperature Temperature (° C) Recovery : 4 to 24hrs of recovery under the standard Recovery : 4 to 24hrs of recovery under the standard 2 Total : 5 cycles 4 3 Step 1 Within 3 Within 3 30± 3 Times (min.) 30± 3 Preheat : 150° C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Dip Time : 10± 0.5sec. Flux : rosin Solder Temperature : 260± 5° C 10± 0.5 seconds Dipping cooling Natural 5± 0.5 seconds Dipping cooling Natural TEST CONDITION Isat(A) will cause Lo to drop approximately 20% HIOKI3540 HP4284A approximately T=40°C without core loss Irms(A) will cause the coil temperature rise solder bath at 245± 5° C for 5 secs After fluxing, component shall be dipped in a melted condition after the removal from test chamber. condition after the removal from test chamber. condition after the removal from test chamber. condition after the removal from test chamber. Random Vibration Test Appearance : Cracking, chipping and any other directions (Total 6 hours). Directions and times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. defects harmful to the characteristics should not be allowed. HIGH CURRENT POWER INDUCTORS SSL1005M SERIES |
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