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L811HW-R68MF-20 Datasheet(PDF) 7 Page - Superworld Electronics |
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L811HW-R68MF-20 Datasheet(HTML) 7 Page - Superworld Electronics |
7 / 10 page SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 30.08.2010 L811HW SERIES 10. RELIABILITY AND TEST CONDITION : TEST CONDITION PERFORMANCE ITEM directions (Total 6 hours). 10±0.5 seconds 60 seconds defects harmful to the characteristics should not No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage Appearance : Cracking, shipping and any other be allowed. Random Vibration Test Humidity Resistance No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage Low Temperature Thermal Shock Life Test Reliability Test High Temperature Life Test +125±3 330±3 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Within 3 Applied Current : Rated Curent Time : 500±12 hours Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. Total : 5 cycles Temperature : 40±5°C Humidity : 90% to 95% Room Temperature 4 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. 30±3 Within 3 Times (min.) Temperature : -55±5°C Time : 500±12 hours Conditions of 1 cycle. Room Temperature Temperature (°C) Step 2 1-55±3 Temperature : 125±5°C Time : 500±12 hours should be covered with solder. 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Solder Heat Resistance Preheating 260°C 150°C Natural Dipping cooling 60 seconds Preheating 150°C 245°C 4±1 seconds Dipping cooling Natural More than 90% of the terminal electrode Refer to standard electrical characteristics list Saturation Current (Isat) Mechanical Performance Test Solderability Test Heat Rated Current (Irms) Electrical Characteristics Test DCR Inductance Solder : Sn99.95-Cu0.05 Preheat : 150°C, 60sec. Dip Time : 10±0.5sec. Solder Temperature : 260±5°C Flux for lead free : rosin Solder : Sn99.95-Cu0.05 Solder Temperature : 245±5°C Dip Time : 4±1sec. Flux for lead free : rosin 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% typ. CH16502, Agilent33420A Micro-Ohm Meter. HP4284A, CH11025, CH3302, CH1320, CH1320S approximately T=40°C without core loss Irms(A) will cause the coil temperature rise 1. Applied the allowed DC current Preheat : 150°C, 60sec. LCR meter. HIGH CURRENT MOLDED POWER INDUCTORS |
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