UM2100

Microsemi

Microwave Products

75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748

Pa

TM

®

ge

1

Copyright

 2007

Rev: 2009-01-19

ATTENUATOR AND POWER PIN DIODES

2 – 30 MHz

RoHS Compliant Versions Available

IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com

KEY FEATURES



HF band (2-30 MHz) PIN



Long Lifetime (25μs typical)



High Power ( 1kW, CW)



High Isolation (32dB)



Low Loss (0.25dB)



Very Low Distortion

(IP3=60dBm)



Voltage ratings to 1000 V



RoHS compliant packaging

Available

1

(use UMX2101B, etc.)

1

The UM2100 series of products can be

supplied with a RoHS compliant finish

(UMX2100) or with a 90/10 Sn/Pb finish.

Consult factory for details.

D E SCRI PTI ON

UM2100 Series PIN diodes are designed for transmit/receive switch

and attenuator applications in HF band (2-30MHz) and below. As

series configured switches, these long lifetime (25μs typical) diodes

can control up to 2.5 kW, CW in a 50 ohm system. In HF band,

insertion loss is less than 0.25dB and isolation is greater than 32dB

(off-state).

The UM2100 series offers the lowest distortion performance in both

transmit and receive modes. Less than 50 mA forward bias is requires

to obtain an IP3 of 60 dBm at 300 kHz with 1 watt per tone. The

forward biased resistance/reactance vs. frequency characteristics are

flat down to 10 kHz. The capacitance vs. reverse bias voltage

characteristic is flat down to 2 MHz. In attenuator configuration, the

UM2100 produces extremely low distortion at low values of attenuator

control current, and very low insertion loss (0.2dB) in the “0dB”

attenuator state.

ABSOLUTE MAXIMUM RATINGS AT 25º C

(UNLESS OTHERWISE SPECIFIED)

Package

Conditions

Dissapation

(W)

( Θ )Thermal

Resistance

(

A

25

25

50V

B

12

12.5

E

½ in. total length to 25

Contact Free Air

2.5

C

25

25

6

D

25

18.75

8

SM

25

15

10

ALL

1 us pulse (Single)

100KW

ALL

-65

ALL

-65

APPLICATIONS/BENEFITS



Isolated stud package available



Surface mount package available



Soldering temperature:

260

maximum