Switching Diode Array

Steering Diode TVS Array™

S C O T TS DALE DIVISION

MAD1109 and MAD1109e3

DESCRIPTION

APPEARANCE

These low capacitance diode arrays are multiple, discrete, isolated

junctions fabricated by a planar process and mounted in a 14-PIN package

for use as steering diodes protecting up to seven I/O ports from ESD, EFT,

or surge by directing them either to the positive side of the power supply

line or to ground (see figure 1). An external TVS diode may be added

between the positive supply line and ground to prevent overvoltage on the

supply rail. They may also be used in fast switching core-driver

applications. This includes computers and peripheral equipment such as

magnetic cores, thin-film memories, plated-wire memories, etc., as well as

decoding or encoding applications. These arrays offer many advantages of

integrated circuits such as high-density packaging and improved reliability.

This is a result of fewer pick and place operations, smaller footprint, smaller

weight, and elimination of various discrete packages that may not be as

user friendly in PC board mounting. They are available with either Tin-Lead

plating termination or as RoHS Compliant with annealed matte-Tin finish by

adding an e”3” suffix to the part number.

Top Viewing Pin Layout

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

7 Diode Array / protects 7 lines

•

Molded 14-Pin Dual-In-Line Package

•

UL 94V-0 Flammability Classification

•

Low Capacitance 1.5 pF per diode

•

Switching speeds less than 5 ns

•

RoHS Compliant devices available by adding “e3” suffix

•

IEC 61000-4 compatible

61000-4-2 (ESD): Air 15kV, contact – 8 kV

61000-4-4 (EFT): 40A – 5/50 ns

61000-4-5 (surge): 12A, 8/20

µs

• Low capacitance steering diode protection for high

frequency data lines

• RS-232 & RS-422 Interface Networks

• Ethernet: 10 Base T

• Computer I / O Ports

• LAN

• Switching Core Drivers

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

• Operating Temperature: -55°C to +150°C

• Storage Temperature: -55°C to +150°C

• Forward Surge Current: 2 Amps (8.3 ms)

12 Amps (8/20

• Continuous Forward Current: 400 mA (one diode)

• Power Dissipation (P

• Solder temperatures: 260°C for 10 s (maximum)

• CASE: Void-free transfer molded thermosetting

epoxy body meeting UL94V-0 flammability

classification

• TERMINALS: Tin-Lead or RoHS Compliant

annealed matte-Tin plating solderable per MIL-STD-

750 method 2026

• MARKING: MSC logo, MAD1109 or MAD1109e3 and

date code. Pin #1 is to the left of the dot or indent on

top of package.

• WEIGHT: 0.997 grams (approximate)

• Carrier tubes: 25 pcs (Standard)

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified

BREAKDOWN

VOLTAGE

V

WORKING

PEAK

REVERSE

VOLTAGE

V

LEAKAGE

CURRENT

µA

LEAKAGE

CURRENT

µA

CAPACITANCE

C

@ 0 V

pF

REVERSE

RECOVERY

TIME

ns

FORWARD

VOLTAGE

V

FORWARD

VOLTAGE

V

PART

NUMBER

MIN

MAX

MAX

MAX

TYP

MAX

MAX

MAX

MAD1109

MAD1109e3

90

75

0.200

20

300

20

1.5

5.0

1.00

1.20

Microsemi

Scottsdale Division

Page 1

Copyright

© 2005

6-28-2005 REV L

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503