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MAD1103 Datasheet(PDF) 1 Page - Microsemi Corporation |
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MAD1103 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 2 page Switching Diode Array Steering Diode TVS Array TM S C O T TS DALE DIVISION MAD1103 and MAD1103e3 DESCRIPTION APPEARANCE These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-PIN package for use as steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing them either to the positive side of the power supply line or to ground (see figure 1). An external TVS diode may be added between the positive supply line and ground to prevent overvoltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as high-density packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting. They are available with either Tin-Lead plating terminations or as RoHS Compliant with annealed matte-Tin finish by adding an “e3“ suffix to the part number. Top Viewing Pin Layout IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • 16 Diode Array / protects 8 lines • Molded 14-Pin Dual-In-Line Package • Low Capacitance 1.5 pF per diode • Switching speeds less than 5 ns • RoHS compliant devices available by adding “e3” suffix • IEC 61000-4 compatible 61000-4-2 (ESD): Air 15 kV, contact 8 kV 61000-4-4 (EFT): 40 A, 5/50 ns 61000-4-5 (surge): 12 A, 8/20 µs • Low capacitance steering diode protection for high frequency data lines • RS-232 & RS-422 Interface Networks • Ethernet: 10 Base T • Computer I / O Ports • LAN • Switching Core Drivers MAXIMUM RATINGS MECHANICAL AND PACKAGING • Operating Temperature: -55°C to +150°C • Storage Temperature: -55°C to +150°C • Forward Surge Current: 2 Amps (8.3 ms) 12 Amps (8/20 µs) • Continuous Forward Current: 400 mA (one diode) • Power Dissipation (P D): 1500 mW (total) • Solder temperatures: 260°C for 10 s (maximum) • CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 flammability classification • TERMINALS: Tin-Lead or RoHS Compliant annealed matte-Tin plating solderable per MIL-STD-750 method 2026 • MARKING: MSC logo, MAD1103 or MAD1103e3 and date code. Pin #1 is to the left of the dot or indent on top of package. • WEIGHT: 0.997 grams (approximate) • Carrier tubes: 25 pcs (Standard) ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified BREAKDOWN VOLTAGE VBR @ IBR =100µA V WORKING PEAK REVERSE VOLTAGE VRWM V LEAKAGE CURRENT IR TA = 25°C µA LEAKAGE CURRENT IR TA = 150°C µA CAPACITANCE C @ 0 V pF REVERSE RECOVERY TIME trr ns FORWARD VOLTAGE VF IF = 10 mA V FORWARD VOLTAGE VF IF = 100 mA V PART NUMBER MIN MAX MAX @VR MAX @VR TYP MAX MAX MAX MAD1103 MAD1103e3 90 75 0.200 20 300 20 1.5 5.0 1.00 1.20 Microsemi Scottsdale Division Page 1 Copyright © 2005 6-28-2005 REV N 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 |
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