LX5503

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

InGaP HBT 5-6GHz Power Amplifier

Copyright

© 2000

Rev. 1.2d, 8/18/2005

TM

®

ABSOLUTE MAXIMUM RATINGS

DC Supply Voltage, RF off ...............................................................................6V

Collector Current ........................................................................................500mA

Total Power Dissipation................................................................................... 3 W

RF Input Power ........................................................................................... 10dBm

Operation Ambient Temperature ....................................................... -40 to +85

Storage Temperature........................................................................ -65 to +150

Peak Package Solder Reflow Temp (40 seconds maximum exposure) .......... 260°C (+0,-5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal

.

PACKAGE PIN OUT

1

2

3

4

5

6

7

8

9

10

11

12

13 14 15 16

1

2

3

4

5

6

7

8

9

10

11

12

13 14 15 16

(Bottom View)

RoHS / Pb-free 100% Matte Tin Lead Finish

FUNCTIONAL PIN DESCRIPTION

Pin Name

Pin Number

Description

RF IN

2, 3

RF input for the power amplifier. This pin is DC-shorted to GND but AC-coupled to the transistor

base of the first stage. For 5.15-5.35GHz this pin is pre-matched to 50

Ω.

Vb1

6

Bias current control voltage for the first stage.

Vb2

7

Bias current control voltage for the second stage. The VB2 pin can be connected with the first

stage control voltage (VB1) into a single reference voltage (referred to as Vref) through an

external resistor bridge(R1/R2).

Vcc

9

Supply voltage for the bias reference and control circuits. The VCC feed line should be

terminated with a 1

μF bypass capacitor as close to the device as possible. This pin can be

combined with both VC1 and VC2 pins, resulting in a single supply voltage (referred to as Vc).

RF OUT

10, 11

RF output for the power amplifier. This pin is AC-coupled and does not require a DC-blocking

capacitor.

Vc1

15

Power supply for first stage amplifier. The VC1 feedline should be terminated with a 220pF

bypass capacitor as close to the device as possible, followed by a 1

μF bypass capacitor at the

supply side. This pin can be combined with VC2 and VCC pins, resulting in a single supply

voltage (referred to as Vc).

Vc2

14

Power supply for second stage amplifier. The VC2 feedline should be terminated with a 220pF

bypass capacitor as close to the device as possible, followed by a 1

μF bypass capacitor at the

supply side. This pin can be combined with VC1 and VCC pins, resulting in a single supply

voltage (referred to as Vc).

GND

The center metal base of the MLP package provides both DC and RF ground as well as heat

sink for the power amplifier.