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TLE4966-3K Datasheet(PDF) 3 Page - Infineon Technologies AG

Part # TLE4966-3K
Description  High Sensitivity Automotive Hall Switch with direction detection
Download  15 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE4966-3K Datasheet(HTML) 3 Page - Infineon Technologies AG

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Datasheet
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Rev.1.0, 2010-09-20
TLE4966-3K
Trademarks of Infineon Technologies AG
ABM™, BlueMoon™, CONVERGATE™, COSIC™, C166™, FALC™, GEMINAX™, GOLDMOS™, ISAC™,
OMNITUNE™, OMNIVIA™, PROSOC™, SEROCCO™, SICOFI™, SIEGET™, SMARTi™, SMINT™,
SOCRATES™, VINAX™, VINETIC™, VOIPRO™, X-GOLD™, XMM™, X-PMU™, XWAY™
Other Trademarks
Microsoft®, Visio®, Windows®, Windows Vista®, Visual Studio®, Win32® of Microsoft Corporation. Linux® of
Linus Torvalds. FrameMaker®, Adobe® Reader™, Adobe Audition® of Adobe Systems Incorporated. APOXI®,
COMNEON™ of Comneon GmbH & Co. OHG. PrimeCell®, RealView®, ARM®, ARM® Developer Suite™ (ADS),
Multi-ICE™, ARM1176JZ-S™, CoreSight™, Embedded Trace Macrocell™ (ETM), Thumb®, ETM9™, AMBA™,
ARM7™, ARM9™, ARM7TDMI-S™, ARM926EJ-S™ of ARM Limited. OakDSPCore®, TeakLite® DSP Core,
OCEM® of ParthusCeva Inc. IndoorGPS™, GL-20000™, GL-LN-22™ of Global Locate. mipi™ of MIPI Alliance.
CAT-iq™ of DECT Forum. MIPS™, MIPS II™, 24KEc™, MIPS32®, 24KEc™ of MIPS Technologies, Inc. Texas
Instruments®, PowerPAD™, C62x™, C55x™, VLYNQ™, Telogy Software™, TMS320C62x™, Code Composer
Studio™, SSI™ of Texas Instruments Incorporated. Bluetooth® of Bluetooth SIG, Inc. IrDA® of the Infrared Data
Association. Java™, SunOS™, Solaris™ of Sun Microsystems, Inc. Philips®, I2C-Bus® of Koninklijke Philips
Electronics N.V. Epson® of Seiko Epson Corporation. Seiko® of Kabushiki Kaisha Hattori Seiko Corporation.
Panasonic® of Matsushita Electric Industrial Co., Ltd. Murata® of Murata Manufacturing Company. Taiyo Yuden™
of Taiyo Yuden Co., Ltd. TDK® of TDK Electronics Company, Ltd. Motorola® of Motorola, Inc. National
Semiconductor®, MICROWIRE™ of National Semiconductor Corporation. IEEE® of The Institute of Electrical and
Electronics Engineers, Inc. Samsung®, OneNAND®, UtRAM® of Samsung Corporation. Toshiba® of Toshiba
Corporation. Dallas Semiconductor®, 1-Wire® of Dallas Semiconductor Corp. ISO® of the International
Organization for Standardization. IEC™ of the International Engineering Consortium. EMV™ of EMVCo, LLC.
Zetex® of Zetex Semiconductors. Microtec® of Microtec Research, Inc. Verilog® of Cadence Design Systems, Inc.
ANSI® of the American National Standards Institute, Inc. WindRiver® and VxWorks® of Wind River Systems, Inc.
Nucleus™ of Mentor Graphics Corporation. OmniVision® of OmniVision Technologies, Inc. Sharp® of Sharp
Corporation. Symbian OS® of Symbian Software Ltd. Openwave® of Openwave Systems, Inc. Maxim® of Maxim
Integrated Products, Inc. Spansion® of Spansion LLC. Micron®, CellularRAM® of Micron Technology, Inc.
RFMD® of RF Micro Devices, Inc. EPCOS® of EPCOS AG. UNIX® of The Open Group. Tektronix® of Tektronix,
Inc. Intel® of Intel Corporation. Qimonda® of Qimonda AG. 1GOneNAND® of Samsung Corporation.
HyperTerminal® of Hilgraeve, Inc. MATLAB® of The MathWorks, Inc. Red Hat® of Red Hat, Inc. Palladium® of
Cadence Design Systems, Inc. SIRIUS Satellite Radio® of SIRIUS Satellite Radio Inc. TOKO® of TOKO Inc.
The information in this document is subject to change without notice.
Last Trademarks Update 2008-11-17
Revision History: 2010-09-20, Rev.1.0
Previous Revision:
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Subjects (major changes since last revision)


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