NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

04.06.2009

CERAMIC CHIP INDUCTORS

C1 SERIES

6. RELIABILITY & TEST CONDITION :

Inductance : Within ±20% of initial value.

Step2 : Room temperature 2 to 5 minutes

ambient temperature

Measurement : After placing for 24 hours (min.) at room

Step4 : Room temperature 2 to 5 minutes

Step3 : +85±2°C 30±3 min.

Number of cycles : 100

45

45

Electrical and mechanical characteristics shall

Consult standard J-STD-002

Consult standard MIL-STD-202

Appearance : No significant abnormality

Appearance : No mechanical damage.

Inductance : Within ±20% of initial value.

Appearance : No mechanical damage.

Inductance : Within ±20% of initial value.

More than 95% coverage of all metabolised area

Appearance : No mechanical damage.

Temperature Cycle

High Temperature

Humidity Resistance

Resistance

Solderability

METHOD 210

be satisfied

Resistance to Solder

Heat

Dip Time : 3±1sec.

Applied Current : rated current (max. value)

Applied Current : rated current (max. value)

ambient temperature

Measurement : After placing for 24 hours (min.) at room

ambient temperature

Measurement : After placing for 24 hours (min.) at room

Temperature : 60±2°C

Duration : 1008±12hrs

Condition for 1 cycle

Step1 : -40±3°C 30±3 min.

Duration : 1008±12hrs

Temperature : 85±2°C

Humidity : 90~95% RH.

Measurement to be made after keeping at room temp

Solder : Sn-Ag3.0-Cu0.5

Dip Time : 6±1sec.

for 24±2hrs

Solder Temperature : 265±3°C

Solder Temperature : 240±5°C

Solder : Sn-Ag3.0-Cu0.5

Preheat : 100 ~ 150°C, 60sec.

100

unit : mm

PERFORMANCE

DCR : Shall be satisfied

Appearance : No significant abnormality

Appearance : No significant abnormality

Impedance change : Within ±30%

DCR : Shall be satisfied

Inductance change : Within ±20%

Substrate Bending

Strength

Terminal Strength

DC Resistance

ITEM

Soldering shall be done in accordance with the

by 3mm hold for 10s and then return.

recommended PC board pattern and reflow soldering

Solder a chip on a test substrate, bend the substrate

Solder chip on PCB and applied 10N (1.02Kgf) for 10sec

HP4338 digital milli-ohm meter

TEST CONDITION