SIDC46D170H

Edited by INFINEON Technologies AI DP PSD CLS, L 4471A, Edition 2, 2.11.2004

Fast switching diode chip in EMCON 3 -Technology

This chip is used for:

•

EUPEC power modules

FEATURES:

•

1700V EMCON 3 technology 200 µm chip

•

soft, fast switching

•

low reverse recovery charge

•

small temperature coefficient

Applications:

•

resonant applications, drives

A

C

Chip Type

Die Size

Package

Ordering Code

SIDC46D170H

1700V

75A

6.8 x 6.8 mm

2

sawn on foil

Q67050-A4175-

A001

MECHANICAL PARAMETER:

Raster size

6.8 x 6.8

Area total / active

46.24 / 34.04

Anode pad size

4.78 x 4.78

mm

2

Thickness

200

µm

Wafer size

150

mm

Flat position

180

deg

Max. possible chips per wafer

304 pcs

Passivation frontside

Photoimide

Anode metallization

3200 nm Al Si Cu

Cathode metallization

Ni Ag –system

suitable for epoxy and soft solder die bonding

Die bond

electrically conductive glue or solder

Wire bond

Al,

≤500µm

Reject Ink Dot Size

∅ 0.65mm; max 1.2mm

Recommended Storage Environment

store in original container, in dry nitrogen,

< 6 month at an ambient temperature of 23°C