Slide Switches

4PDT Slide Switches

SB9 Series

General Specifications:

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D

CIRCUIT DIAGRAM

P.C.B. LAYOUT

(TOP VIEW)

15.18± 0.7

2.5± 0.3

2.54× (P-1)=12.7± 0.4

0.5± 0.1

2.54± 0.2

7.62± 0.5

8.5± 0.5

EXTENDED ACTUATOR

LOW PROFILE ACTUATOR

(0.597)

(0.099)

(0.335)

(0.100)

(0.1× (P-1))

(0.020)

(0.300)

1

2

12.7± 0.5

(0.1× (P-1))

IA.HOLE

C

1 C2

1

C2

C

1

2

(0.099)

2.5± 0.3

15.18± 0.7

(0.597)

LOW PROFILE ACTUATOR

2.54× (P-1)=12.7± 0.4

2.54± 0.2

(0.1× (P-1))

(0.100)

(0.020)

1

C2

C

1

11

C

2

C

2

2

CIRCUIT DIAGRAM

0.5± 0.1

9.6± 0.5

(0.378)

EXTENDED ACTUATOR

9.6± 0.5

(0.378)

2.54× (P-1) ± 0.2

(0.100× (P-1))

P.C.B. PATTERN

1.15± 0.5

(0.045)

SB9

How to order:

Material, Actuator and Sealing Options:

LA

EA

TA

TR

TT

Low Profile Actuator and rows spacing 8.50mm (Standard)

Extended Actuator and rows spacing 7.62mm (Standard)

Top Tape Sealed and Low Profile Actuator

Tape & Reel Package, product without Top Tape Sealed

Tape & Reel Package, product with Top Tape Sealed

Special product number:

H

S

THT Terminal

SMT Terminal

RoHS Compliant:

R

RoHS Compliant

1

2

3

1

2

3

FEATURES

Molded 0.3" integrated circuit packing outline allowing automatic insertion

Smaller size makes better heat convection during PC board wave soldering

Top tape sealed to withstand wave soldering, board washing

Housing materials are UL 94V-O grade fire retardant plastics

SPECIFICATIONS

1. ELECTRICAL

Switching: 25mA, 24VDC

Contact Rating

Non-Switching: 100mA, 50VDC

Initial: 50m

Max.

Contact Resistance

After life test: 100m

Max.

Insulation Resistance

1000M

Min. at 100VDC

Dielectric Strength

500VDC Min. for 1minute

Capacitance between adjacent switched 5pF Max.

2 MECHANICAL AND ENVIRONMENTAL

Operating: -25

to +70

Temperature Rating

Storage: -40

to +85

Operation force

100g Min. & 1000g Max.

Mechanical Life

10,000 Operations

Humidity

95%RH, 40

for 96hours

.

s

r

H

6

r

o

f

z

H

5

5

o

t

0

1

n

o

i

t

a

r

b

i

V

Solderability

After flux 230

±5

for 5

±0.5seconds,

95% coverage

Resistance to soldering heat

(for through hole type)

260

±5

for 5

±1sec

Reflow soldering heat for SMT type

(reference)