MCIMX287CVM4B datasheet(1/70 Pages) FREESCALE

Part #	MCIMX287CVM4B

Description	Processors Data Sheet for Consumer Products

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX28CEC

Rev. 1, 04/2011

i.MX28

Package Information

Plastic package

Case 5284 14 x 14 mm, 0.8 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1

Introduction

The i.MX28 is a low-power, high-performance

applications processor optimized for the general

embedded industrial and consumer markets.The

core of the i.MX28 is Freescale's fast,

power-efficient implementation of the

ARM926EJ-S™ core, with speeds of up to

454 MHz.

The device is suitable for a wide range of

applications, including the following:

•

Human-machine interface (HMI) panels:

industrial, home

•

Industrial drive, PLC, I/O control display,

factory robotics display, graphical remote

controls

•

Handheld scanners and printers

•

Patient-monitoring, portable medical

devices

•

Smart energy meters, energy gateways

•

Media phones, media gateways

The integrated power management unit (PMU) on

the i.MX28 is composed of a triple output DC-DC

switching converter and multiple linear regulators.

These provide power sequencing for the device and

its I/O peripherals such as memories and SD cards,

as well as provide battery charging capability for

Li-Ion batteries.

i.MX28 Applications

Processors Data Sheet for

Consumer Products

Silicon Version 1.2

Contents

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2.

Ordering Information & Functional Part Differences 3

1.3.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1.

Special Signal Considerations . . . . . . . . . . . . . . . 10

3.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1.

i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11

3.2.

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19

3.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19

3.4.

I/O AC Timing and Parameters . . . . . . . . . . . . . . . 24

3.5.

Module Timing and Electrical Parameters . . . . . . 28

4.

Package Information and Contact Assignments . . . . . . . 60

4.1.

289-Ball MAPBGA—Case 14 x 14 mm,

0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

4.2.

Ground, Power, Sense, and Reference Contact

Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

4.3.

Signal Contact Assignments . . . . . . . . . . . . . . . . . 62

4.4.

i.MX287 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 65

4.5.

i.MX286 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 66

4.6.

i.MX283 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 67

4.7.

i.MX280 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

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