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MAX16903RATB Datasheet(PDF) 3 Page - Maxim Integrated Products |
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MAX16903RATB Datasheet(HTML) 3 Page - Maxim Integrated Products |
3 / 13 page 2.1MHz, High-Voltage, 1A Mini-Buck Converter _______________________________________________________________________________________ 3 ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VSUP = +14V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. (Voltages referenced to GND.) SUP, EN..................................................................-0.3V to +42V BST to LX..................................................................-0.3V to +6V LX..............................................................-0.3V to (VSUP + 0.3V) BST .........................................................................-0.3V to +47V OUTS ......................................................................-0.3V to +12V SYNC, PGOOD, BIAS............................................-0.3V to +6.0V PGND to GND .......................................................-0.3V to +0.3V LX Continuous RMS Current .................................................1.5A OUTS Short-Circuit Duration ......................................Continuous ESD Protection Human Body Model .........................................................±2kV Machine Model ..............................................................±200V Continuous Power Dissipation (TA = +70°C) TDFN (derate 24.4 mW/°C above +70°C)......................1951mW TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( θJA) ...........41°C/W Junction-to-Case Thermal Resistance ( θJC) ..................9°C/W TSSOP Junction-to-Ambient Thermal Resistance ( θJA) ........38.3°C/W Junction-to-Case Thermal Resistance ( θJC) ..................3°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS (Note 2) 3.5 28 Supply Voltage Range VSUP t < 1s 42 V EN = low 4 8 EN = high, no load 25 35 μA Supply Current ISUP EN = high, continuous, no switching 1 mA VUVLO Bias rising 2.8 3 3.2 UV Lockout VUVLO,HYS Hysteresis 0.4 V Bias Voltage VBIAS +5.5V VSUP +42V 5 V Bias Current Limit IBIAS 10 mA BUCK CONVERTER VOUT = 5V, fixed frequency -2.0% 5 +2.5% VOUT,5V VOUT = 5V, SKIP mode (Note 3) -2.0% 5 +4% VOUT = 3.3V, fixed frequency -2.0% 3.3 +2.5% VOUT,3.3V VOUT = 3.3V, SKIP mode (Note 3) 6V VSUP 18V, ILOAD = 0 to 1A, TA = 0°C to +125°C -2.0% 3.3 +4% VOUT = 5V, fixed frequency -3.0% 5 +2.5% VOUT,5V VOUT = 5V, SKIP mode (Note 3) -3.0% 5 +4% VOUT = 3.3V, fixed frequency -3.0% 3.3 +2.5% Voltage Accuracy VOUT,3.3V VOUT = 3.3V, SKIP mode (Note 3) 6V VSUP 18V, ILOAD = 0 to 1A, TA = -40°C to +125°C -3.0% 3.3 +4% V |
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