Programmable, High-Speed, Multiple

Input/Output LVDS Crossbar Switches

2

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ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Short-Circuit Duration (all outputs).............................Continuous

32-Pin TQFP (derate 27.8mW/°C above +70°C)........2222mW

20-Pin TSSOP (derate 26.5mW/°C above +70°C) .....2122mW

Operating Temperature Range .........................-40°C to +105°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

ESD Protection

Human Body Model (RD = 1.5kΩ, CS = 100pF)

All Other Pins Including SCL, SDA to GND .................±2kV

IEC 61000-4-2 (RD = 330Ω, CS = 150pF)

Contact Discharge

(DIN_, DOUT_) to GND ..............................................±10kV

Air-Gap Discharge

(DIN_, DOUT_) to GND ..............................................±15kV

ISO 10605 (RD = 2kΩ, CS = 330pF)

Contact Discharge

(DIN_, DOUT_) to GND ..............................................±10kV

Air-Gap Discharge

(DIN_, DOUT_) to GND ..............................................±25kV

Lead Temperature (soldering, 10s) ................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

3.0

3.6

V

MAX9132

60

80

Supply Current

Outputs switching at

20MHz

MAX9134/MAX9135

86

100

mA

SINGLE-ENDED CMOS INPUTS (

PD, FS, RXD)

Input High Level

2.0

V

Input Low Level

0.8

V

Input High Current

-20

+20

µA

SINGLE-ENDED OUTPUTS (TXD, AS1/NSLP)

Output High Level

0.4

V

Output Low Level

0.4

V

3-LEVEL INPUTS (S5–S0, AS0, AS1)

Input High Level

2.5

V

Input Low Level

0.8

V

Input Open Level

Measured at the input pins

1.2

1.45

1.9

V

Input Current

-20

+20

µA

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

20 TSSOP-EP

Junction-to-Ambient Thermal Resistance (

Junction-to-Case Thermal Resistance (

32 TQFP-EP

Junction-to-Ambient Thermal Resistance (

Junction-to-Case Thermal Resistance (

PACKAGE THERMAL CHARACTERISTICS (Note 1)