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MAX9132GUP Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX9132GUP Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 20 page Programmable, High-Speed, Multiple Input/Output LVDS Crossbar Switches 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS DC ELECTRICAL CHARACTERISTICS (VAVDD = VDVDD = VLVDSVDD = +3.0V to +3.6V, TA = -40°C to +105°C, unless otherwise noted. Typical values are at VAVDD = VDVDD = VLVDSVDD = +3.3V, TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VDD to GND ...........................................................-0.3V to +4.0V All Pins to GND .............................................-0.3V to VDD + 0.3V Short-Circuit Duration (all outputs).............................Continuous Continuous Power Dissipation (TA = +70°C) 32-Pin TQFP (derate 27.8mW/°C above +70°C)........2222mW 20-Pin TSSOP (derate 26.5mW/°C above +70°C) .....2122mW Operating Temperature Range .........................-40°C to +105°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C ESD Protection Human Body Model (RD = 1.5kΩ, CS = 100pF) All Other Pins Including SCL, SDA to GND .................±2kV IEC 61000-4-2 (RD = 330Ω, CS = 150pF) Contact Discharge (DIN_, DOUT_) to GND ..............................................±10kV Air-Gap Discharge (DIN_, DOUT_) to GND ..............................................±15kV ISO 10605 (RD = 2kΩ, CS = 330pF) Contact Discharge (DIN_, DOUT_) to GND ..............................................±10kV Air-Gap Discharge (DIN_, DOUT_) to GND ..............................................±25kV Lead Temperature (soldering, 10s) ................................+300°C Soldering Temperature (reflow) .......................................+260°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VDD 3.0 3.6 V MAX9132 60 80 Supply Current IAVDD, IDVDD, ILVDSVDD Outputs switching at 20MHz MAX9134/MAX9135 86 100 mA SINGLE-ENDED CMOS INPUTS ( PD, FS, RXD) Input High Level VIH1 2.0 V Input Low Level VIL1 0.8 V Input High Current IIN1 VIN = 0 to VDD -20 +20 µA SINGLE-ENDED OUTPUTS (TXD, AS1/NSLP) Output High Level VOH VDD - 0.4 V Output Low Level VOL IOL = 4mA 0.4 V 3-LEVEL INPUTS (S5–S0, AS0, AS1) Input High Level VIH3 2.5 V Input Low Level VIL3 0.8 V Input Open Level VIO3 Measured at the input pins 1.2 1.45 1.9 V Input Current IL3, IH3 VIL3 = 0V or VIH3 = VDD -20 +20 µA Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. 20 TSSOP-EP Junction-to-Ambient Thermal Resistance ( θJA) ........37.7°C/W Junction-to-Case Thermal Resistance ( θJC) ..................2°C/W 32 TQFP-EP Junction-to-Ambient Thermal Resistance ( θJA) ...........36°C/W Junction-to-Case Thermal Resistance ( θJC) ..................4°C/W PACKAGE THERMAL CHARACTERISTICS (Note 1) |
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