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MAX4936CTN Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX4936CTN Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 19 page 2 ______________________________________________________________________________________ Octal High-Voltage Transmit/Receive Switches Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All voltages referenced to GND, unless otherwise noted.) VDD Positive Supply Voltage...................................-0.3V to +6V VCC, LVCC_ Positive Supply Voltage ....................-0.3V to +6V VEE, LVEE_ Negative Supply Voltage ....................-6V to +0.3V CLK, DIN, CLR, LE Input Voltage ..........................-0.3V to +6V DOUT Output Voltage ..............................-0.3V to (VDD + 0.3V) HV_ Input Voltage (MAX4936/MAX4938) ..........-120V to +120V COM_ Input/Output Voltage...............................-120V to +120V NO_ Output Voltage (MAX4936/MAX4937) ...................... Q1.5V NO_ Output Voltage (MAX4938/MAX4939) ......................... Q6V Voltage Difference Across Any or All HV_ (MAX4936/MAX4938) ...................................... Q230V Voltage Difference Across Any or All COM_ .................. Q230V Continuous Current (HV_ to COM_ ) (MAX4936/MAX4938)..Q250mA Continuous Current (Any Other Terminal)..................... Q100mA Peak Current (HV_ to COM_ ) (MAX4936/MAX4938) (Pulsed at 1ms, 0.1% Duty Cycle) ................................ Q2.5A Continuous Power Dissipation (TA = +70NC) TQFN (derate 41.0mW/NC above +70NC) .................3279mW Operating Temperature Range............................. 0NC to +70NC Storage Temperature Range............................ -65NC to +150NC Junction Temperature ................................................... +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC ELECTRICAL CHARACTERISTICS (VDD = +1.62V to +5.5V, VCC = +2.7V to +5.5V, VEE = -2.7V to -5.5V, VCLR = 0V, LVCC_ = VCC, LVEE_ = VEE, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistance were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Resistance ( qJA)...........44°C/W Junction-to-Case Thermal Resistance ( qJC).................10°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC CHARACTERISTICS HV_ Input Voltage Range VIRHV_ MAX4936/MAX4938 only -115 +115 V |Difference Across Any or All HV_ | MAX4936/MAX4938 only 220 V COM_ Output Voltage Range VORCM_ |VHV_| R +2V, IHV_ = Q100mA (MAX4936/ MAX4938 only) VHV_ - 1 VHV_ Q 0.85 VHV_ + 1 V COM_ Input Voltage Range VIRCM_ -115 +115 V |Difference Across Any or All COM_ | 220 V NO_ Output Voltage Range VORNO_ VCC = +5V, VEE = -5V, |VCOM_| R +2V, RL = 200I, CL = 30pF, ICH_ = 10mA (MAX4936/MAX4937 only) -1 Q 0.75 +1 V VCC = +5V, VEE = -5V, |VCOM_| < +0.4V, RL = 200I, CL = 30pF, ICH_ = 1.5mA VCOM_ - 0.2 VCOM_ Q 0.1 VCOM_ + 0.2 HV_ to COM_ Continuous Current ICN_ VCOM_ = 0V (MAX4936/MAX4938 only) -200 +200 mA HV_ to COM_ Drop VCN_ VCOM_ = 0V, ICN_ = Q2A (MAX4936/MAX4938 only) Q 2 V Diode Bridge Voltage Offset VOFF_ VCC = +5V, VEE = -5V, COM_ = unconnected, NO_ = unconnected, ICH = 1.5mA -200 +200 mV |
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