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CLV6A-FKB-CK1P1G1BB7R3R3 Datasheet(PDF) 10 Page - Cree, Inc |
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CLV6A-FKB-CK1P1G1BB7R3R3 Datasheet(HTML) 10 Page - Cree, Inc |
10 / 11 page 10 CLD-CT1163.002 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/ledlamps Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Reflow Soldering • TheCLV6A-FKBisratedasaMSL3product. • Therecommendedfloorlifeoutofbagis24hrs. • Thebestpracticessuggestionistousetheproductassoonaspossiblewhenremovedfromthebag. • Thetemperature(TopsurfaceofSMDLED)profileisasbelow: Use only with CLV6A-FKB Solderingpad: Solder = Low Lead-Free Average ramp-up rate = 4ºC/s max Preheat temperature = 150ºC ~200ºC Preheat time = 120s max Ramp-down rate = 6ºC/s max Peak temperature = 235ºC max Time within 5ºC of actual Peak Temperature = 10s max Duration above 217ºC is 45s max Document No.: COTCO-05-0057 Rev. NO.: 13 6/9 Melting-point Pre-heat Soak Reflow Cooling Time Use all SMD besides LP6-NPP1-01-N1 Solder = Sn63-Pb37 Solder = Lead-free Average ramp-up rate =4ºC/s max. Average ramp-up rate =4ºC/s max Preheattemperature = 100ºC ~150ºC Preheattemperature = 150ºC ~200ºC Preheattime = 100s max. Preheattime = 100s max. Ramp-down rate =6ºC/s max. Ramp-down rate =6ºC/s max. Peaktemperature = 230ºC max. Peaktemperature = 250ºC max. Time within5ºC of actual Peak Temperature = 10s max. Time within5ºC of actual Peak Temperature = 10s max. Duration above 183ºC is 80s max. Duration above 217ºC is 80s max. Only use LP6-NPP1-01-N1 [13] Solder = Low Lead-free Average ramp-up rate =3ºC/s max. Preheattemperature = 130ºC ~170ºC Preheattime = 120s max. Ramp-down rate =6ºC/s max. Peaktemperature = 213ºC max. Time within3ºC of actual Peak Temperature = 25s max. Duration above 200ºC is 40s max. Recommended solder pad designfor heat dissipation (2-pin SMD LED): 7.0 2.6 Recommended solder pad designfor heat dissipation (4-pin SMD LED) 8.2 2.7 |
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