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CLD-CT979.003

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Fax: +1.919.313.5778

www.cree.com/ledlamps

Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and

the Cree logo are registered trademarks of Cree, Inc.

Soldering & Handling

1. Cleaning

• Don’tuseunspecifiedchemicalliquidstocleantheSMDLED;thechemicalcouldharmtheSMDLED.When

washing is necessary, please immerse the SMD LED in alcohol at normal room temperature for less than 1

minute and dry at normal room temperature for 15 minutes before use.

• TheinfluenceofultrasoniccleaningontheSMDLEDdependingonfactorssuchasultrasonicpowerandtheway

SMDLEDaremounted.Ultrasoniccleaningshallbepre-qualifiedtoensurethiswillnotcausedamagetothe

SMD LED.

2. Moisture-Proof Packing

• In order to prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is

packed in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the

secondary protection. The indication of humidity indicator card provides the information of humidity within SMD

packing.

3. Storage

• Shelflifeinoriginalsealedbagatstorageconditionof<40ºCand<90%RHis12months.Bakingisrequired

whenever shelf life is expired.

• Before openning the packaging , Please check whether bag leak air or not.

• Afterbagopening,theSMDLEDmustbestoredunderthecondition<30ºCand<60%RH.Underthiscondition,

SMDLEDmustbeused(subjecttoreflow)within168hoursafterbagopening,andre-bakingisrequiredwhen

exceeding 168 hours.

• Forbaking,placeSMDLEDinovenattemperature80ºC±5ºCandrelativehumidity<=10%RH,for24hours.

• Take out the material from packaging bag for re-bake. Do not open the door of oven frequently during the baking

process.

4. Soldering

• Manual soldering by soldering iron

• The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at

below 315ºC, with soldering time within 2 seconds.

• The epoxy resin of SMD LED should not be in contact with tip of soldering iron.

• No mechanical stress should be exerted on the resin portion of SMD LED during soldering.

• Handling of SMD LED should be done when the package has been cooled down to below 40ºC or less. This is to

prevent the SMD LED failures due to thermal-mechanical stress during handling.

• ReflowSoldering:Thetemperature(topsurfaceofSMDLED)profileisasbelow:

Melting-point

Pre-heat

Soak

Reflow

Cooling

Time

Heat Sink

Solder = Lead-free

Average ramp-up rate = 4ºC/s max

Peak temperature = 250ºC max.

Preheat temperature = 150ºC ~200ºC

Time within 5ºC of actual Peak Temperature = 10s max.

Preheat time = 100s max.

Duration above 217ºC is 80s max.

Ramp-down rate = 6ºC/s max.