51

© 2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Soldering Parameters

Reflow Condition

Pb-Free assembly

(see Figure 1)

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60-180 secs

Average ramp up rate (LiquidusTemp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60-150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

30 seconds max

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes max

Do not exceed

260°C

Physical Specifications

Lead Material

Copper Alloy

Terminal Finish

100% Matte-Tin Plated

Body Material

UL recognized epoxy meeting flammability

classification 94V-0

Environmental Specifications

High Temp Voltage

Blocking

80% Rated V

504 or 1008 hrs. MIL-STD-750 (Method 1040)

JEDEC, JESD22-A-101

Temp Cycling

cycles. MIL-STD-750 (Method 1051) EIA/

JEDEC, JESD22-A104

Biased Temp &

Humidity

52 V

DC

EIA/JEDEC, JESD22-A-101

High Temp Storage

1031) JEDEC, JESD22-A-101

Low Temp Storage

-65°C, 1008 hrs.

Thermal Shock

10 cycles. MIL-STD-750 (Method 1056)

JEDEC, JESD22-A-106

Autoclave (Pressure

Cooker Test)

EIA/JEDEC, JESD22-A-102

Resistance to Solder

Heat

2031)

Moisture Sensitivity

Level

Time

25

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

Figure 1