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FSL116HR Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FSL116HR Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 13 page © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FSL116HR • Rev. 1.0.0 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. TJ = 25°C, unless otherwise specified. Symbol Parameter Min. Max. Unit VSTR VSTR Pin Voltage -0.3 650.0 V VDS Drain Pin Voltage -0.3 650.0 V VCC Supply Voltage 26 V VFB Feedback Voltage Range -0.3 12 V ID Continuous Drain Current 1 A IDM Drain Current Pulsed (4) 4 A EAS Single Pulsed Avalanche Energy (5) 38 mJ PD Total Power Dissipation 1.5 W TJ Operating Junction Temperature Internally Limited °C TA Operating Ambient Temperature -40 +105 °C TSTG Storage Temperature -55 +150 °C ESD Human Body Model, JESD22-A114 (6) 5 KV Charged Device Model, JESD22-C101 (6) 2 ΘJA Junction-to-Ambient Thermal Resistance (7,8) 80 °C/W ΘJC Junction-to-Case Thermal Resistance (7,9) 19 °C/W ΘJT Junction-to-Top Thermal Resistance (7,10) 33.7 °C/W Notes: 4. Repetitive rating: pulse width limited by maximum junction temperature. 5. L=30mH, starting TJ=25°C. 6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101. 7. All items are tested with the standards JESD 51-2 and JESD 51-10. 8. ΘJA free-standing, with no heat-sink, under natural convection. 9. ΘJC junction-to-lead thermal characteristics under ΘJA test condition. TC is measured on the source #7 pin closed to plastic interface for ΘJA thermo-couple mounted on soldering. 10. ΘJT junction-to-top of thermal characteristic under ΘJA test condition. Tt is measured on top of package. Thermo- couple is mounted in epoxy glue. |
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