© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSGM0465RB • Rev. 1.0.2

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

650

V

Drain Pin Voltage

650

V

26

V

Feedback Pin Voltage

-

0.3

12.0

V

Drain Current Pulsed

10

A

Continuous Switching Drain Current

(6)

5.0

A

3.2

A

Single Pulsed Avalanche Energy

(7)

250

mJ

(8)

45

W

Maximum Junction Temperature

+150

°C

Operating Junction Temperature

(9)

-

40

+125

°C

Storage Temperature

-

55

+150

°C

Minimum Isolation Voltage

(10)

2.5

V

ESD

Electrostatic

Discharge Capability

Human Body Model, JESD22-A114

2

kV

Charged Device Model, JESD22-C101

2

Notes:

6.

and junction temperature (see Figure 4).

7.

8.

Infinite cooling condition (refer to the SEMI G30-88).

9.

Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.

10. The voltage between the package back side and the lead is guaranteed.

Figure 4. Repetitive Peak Switching Current

Thermal Impedance

Symbol

Parameter

Value

Unit

Junction-to-Ambient Thermal Impedance

(11)

62.5

°C/W

Junction-to-Case Thermal Impedance

(12)

3

°C/W

Notes:

11. Infinite cooling condition (refer to the SEMI G30-88).

12. Free standing with no heat-sink under natural convection.