© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN7361, FAN7362 Rev. 1.0.8

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

High-Side Offset Voltage

V

High-Side Floating Supply Voltage

-0.3

625

High-Side Floating Output Voltage

Logic Fixed Supply Voltage

-0.3

25

Logic Input Voltage

-0.3

Allowable Offset Voltage Slew Rate

± 50

V/ns

Power Dissipation

0.625

W

Thermal Resistance, Junction-to-Ambient

200

°C/W

Junction Temperature

+150

°C

Storage Temperature

+150

°C

Ambient Temperature

-40

+125

°C

Notes:

2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).

3. Refer to the following standards:

JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection

JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

High-Side Floating Supply Voltage

V

High-Side Floating Supply Offset Voltage

600

High-Side Output Voltage

Logic Input Voltage

GND

Logic Supply Voltage

10

20

Symbol

Characteristics

Min.

Max.

Unit

Symbol

Parameter

Min.

Max.

Unit