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XP1005-BD Datasheet(PDF) 4 Page - Mimix Broadband |
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XP1005-BD Datasheet(HTML) 4 Page - Mimix Broadband |
4 / 7 page 35.0-43.0 GHz GaAs MMIC Power Amplifier Page 4 of 7 Mechanical Drawing Bias Arrangement Bypass Capacitors - See App Note [2] (Note: Engineering designator is 38H4PBA0157) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg. Bond Pad #1 (RF In) Bond Pad #2 (Vg2) Bond Pad #3 (Vd2) Bond Pad #4 (Vg3A) Bond Pad #5 (Vd3A) Bond Pad #6 (Vg4A) Bond Pad #7 (Vd4A) Bond Pad #8 (RF Out) Bond Pad #9 (Vd4B) Bond Pad #10 (Vg4B) Bond Pad #11 Vd3B) Bond Pad #12 (Vg3B) Bond Pad #13 (Vd1) Bond Pad #14 (Vg1) Vg2,3 Vd2,3 RF Out Vd4 Vg4 RF In Vg1 Vd1 XP1005-BD 1.825 (0.072) 1 2 3 4 5 6 7 8 9 10 11 12 13 1.163 (0.046) 1.562 (0.062) 1.960 (0.077) 2.362 (0.093) 3.162 (0.125) 2.764 (0.109) 2.362 (0.093) 1.960 (0.077) 1.562 (0.062) 1.163 (0.046) 0.0 0.0 0.831 (0.033) 14 2.764 (0.109) 3.162 (0.125) 0.478 (0.019) 3.526 (0.139) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Vd2,3 Vg2,3 RF In Vg1 RF Out Vd1 Vg4 Vd4 P1005-BD Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. ©2011 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. March 2011 - Rev 22-Mar-11 |
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