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MASW-005100-1194 Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc. |
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MASW-005100-1194 Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc. |
6 / 7 page V3 MASW-005100-1194 HMIC™ SP5T Silicon PIN Diode Switch ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 6 ASSEMBLY INSTRUCTIONS Cleanliness The chip should be handled in a clean environment free of organic contamination. Electro-Static Sensitivity The MASW-005100-1194 PIN switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures must be used. Wire Bonding Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy, if necessary, should be adjusted to the minimum power required to achieve a good bond. RF wire and ribbon lengths should be kept as short as possible to minimize parasitic inductance. Mounting These chips have Ti-Pt-Au back metal and can be mounted using 80Au/20Sn eutectic solder or electrically conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants. Eutectic Die Attachment An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The chip should not be exposed to temperatures greater than 320°C for more than 10 seconds. No more than 3 seconds should be required for the die attachment. Silver Epoxy Die Attachment A controlled thickness of no more than 2 mils is recommended for the best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended schedule. Typically +150°C for 1 hour. |
Similar Part No. - MASW-005100-1194_2 |
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Similar Description - MASW-005100-1194_2 |
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