6

50 MHz - 20 GHz

Rev. V2

MASW-003103-1364

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting

pads are conveniently located on the bottom surface of these devices and are removed from the active junction

locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of

80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W,

conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typi-

cally 1 hour at 150°C.

When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up

tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recom-

mended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit

board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die

so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be per-

formed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transpar-

ent, the edges of the mounting pads can be visually inspected through the die after attachment is completed.

“Surface Mounting Instructions“ and can viewed on the MA-COM Technology Solutions website @

www.macomtech.com