Sheet No.: D1-A02001EN

5

PT480FE0000F

■ Packing Specifications

1.

Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.

2.

Bags are secured in a box as shown in the illustration on PAGE CROSSREFERENCE.

3.

Product mass: 0.09 g (approximately)

■ Design Notes

1.

This product is not designed to resist electromagnetic and ionized-particle radiation.

■ Manufacturing Guidelines

● Cleaning Instructions

1.

Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2.

Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3.

Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4.

Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

● Soldering Instructions

1.

Sharp does not recommend using preheat or solder reflow methods when soldering this part.

2.

If hand soldering, use temperatures

≤260°C for ≤5 seconds.

3.

When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the

solder, the pad, and the circuit board.

4.

Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Fig. 4 Soldering Area

1.4 mm

Solderable