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PR33MF51YSZF Datasheet(PDF) 10 Page - Sharp Corporation |
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PR33MF51YSZF Datasheet(HTML) 10 Page - Sharp Corporation |
10 / 14 page 10 Sheet No.: D4-A03901EN PR33MF51NSZF Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. 12 3 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak (package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min) Flow Soldering (No Solder bathing) Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the im- pact on the junction between the device and PCB varies depending on the tooling and soldering conditions. |
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