Electronic Components Datasheet Search |
|
MA4SPS502 Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
|
MA4SPS502 Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 4 page 2 SURMOUNTTM PIN Diode Rev. V2 MA4SPS502 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Electrical Specifications @ TAMB = +25°C Symbol Conditions Units Min. Typical Max. CT -40V, 1MHz pF 0.140 0.200 -40V, 1GHz pF 0.090 RS 100mA, 100MHz 1.4 2.2 20mA, 100MHz 2.4 3.2 VF 10mA V 0.87 1.00 VR 10μA V | -200 | | -275 | -200V μA | -10 | -40V nA 8 θJL Steady State °C/W 50 TL +10mA / -6mA ( 50% - 90% V ) μS 2.8 IR Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individ- ual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junc- tion locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn or RoHS compliant solders is recom- mended. A conductive silver epoxy may also be used . When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vac- uum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended to use a Gold-Tin interface at the circuit board mounting pads. Position the device so that its mounting pads are force aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 grams of perpendicular to the top surface of the die. The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce thermal and/or mechanical stresses. It is also not recom- mended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is trans- parent, the edges of the mounting pads can be visually inspected through the die after attach is completed. |
Similar Part No. - MA4SPS502 |
|
Similar Description - MA4SPS502 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |