2

Rev. V2

MA4SPS502

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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• India Tel: +91.80.43537383

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Symbol

Conditions

Units

Min.

Typical

Max.

-40V, 1MHz

pF

0.140

0.200

-40V, 1GHz

pF

0.090

100mA, 100MHz



1.4

2.2

20mA, 100MHz



2.4

3.2

10mA

V

0.87

1.00

10μA

V

| -200 |

| -275 |

-200V

μA

| -10 |

-40V

nA

8

Steady State

°C/W

50

+10mA / -6mA

( 50% - 90% V )

μS

2.8

Handling

All semiconductor chips should be handled with care

to avoid damage or contamination from perspiration

and skin oils. The use of plastic tipped tweezers or

vacuum pickups is strongly recommended for individ-

ual components. Bulk handling should ensure that

abrasion and mechanical shock are minimized.

Die Attach

Attachment to a circuit board is made simple through

the use of surface mount technology. Mounting pads

are conveniently located on the bottom surface of

these devices and are removed from the active junc-

tion locations. These devices are well suited for solder

attachment onto hard and soft substrates. The use of

80/20, Au/Sn or RoHS compliant solders is recom-

mended. A conductive silver epoxy

may also be

used .

When soldering these devices to a hard substrate, hot gas

die bonding is preferred. We recommend utilizing a vac-

uum tip and force of 60 to 100 grams applied to the top

surface of the device. When soldering to soft substrates, it

is recommended to use a Gold-Tin interface at the circuit

board mounting pads. Position the device so that its

mounting pads are force aligned with the circuit board

mounting pads and reflow the solder by heating the circuit

trace near the mounting pads while applying 60 to 100

grams of perpendicular to the top surface of the die.

The solder joint must not be made one pad at a time.

Doing so could create unequal heat flow and produce

thermal and/or mechanical stresses. It is also not recom-

mended to reflow solder by causing heat to flow through

the top surface of the die. Since the HMIC glass is trans-

parent, the edges of the mounting pads can be visually

inspected through the die after attach is completed.