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MA4AGSW1A_V5 Datasheet(PDF) 7 Page - M/A-COM Technology Solutions, Inc. |
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MA4AGSW1A_V5 Datasheet(HTML) 7 Page - M/A-COM Technology Solutions, Inc. |
7 / 7 page SPST Non-Reflective AlGaAs PIN Diode Switch V5 MA4AGSW1A ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. 7 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Ordering Information Part Number Package MA4AGSW1A Waffle Pack ASSEMBLY INSTRUCTIONS CLEANLINESS These chips should be handled in a clean environment. STATIC SENSITIVITY These Devices are considered ESD Class 1A, HBM. Proper ESD techniques should be used when handling these devices. GENERAL HANDLING The protective polymer coating on the active areas of the die provides scratch and impact protection, particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with vacuum pickup tools, or alternatively with plastic tweezers. ASSEMBLY TECHNIQUES The MA4AGSW1A, AlGaAs device is designed to be mounted with electrically conductive silver epoxy or with a low temperature solder perform, which does not have a rich tin content. SOLDER DIE ATTACH Only solders which do not scavenge gold, such as 80Au/Sn20, or Indalloy #2 is recommended. Do not expose die to temperatures greater than 300°C for more than 10 seconds. ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal resistance. Cure epoxy per manufacturer ’s schedule. Typically 150°C for 1 hour. RIBBON/WIRE BONDING Thermo-compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads. A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the lowest inductance and best microwave performance. For more detailed handling and assembly instructions, see Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” at www.macomtech.com. |
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