Document #: 38-05579 Rev. *I

Page 5 of 15

Capacitance

Parameter[9]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Note

9. Tested initially and after any design or process changes that may affect these parameters.

Thermal Resistance

Parameter[9]

Description

Test Conditions

TSOP I

SOIC

STSOP

Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 x 4.5 inch,

two-layer printed circuit board

33.01

48.67

32.56

°C/W

Thermal resistance

(junction to case)

3.42

25.86

3.59

°C/W

Figure 4. AC Test Loads and Waveforms

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

V

Equivalent to:

THEVENIN

EQUIVALENT

ALL INPUT PULSES

R1

Parameters

2.50V

3.0V

Unit

R1

16667

1103



R2

15385

1554



8000

645



1.20

1.75

V

Data Retention Characteristics

(Over the Operating Range)

Parameter

Description

Conditions

Min

Typ[10] Max Unit

1.5

–

–

V

Data retention current

Industrial

–

–

3

µA

Chip deselect to data retention time

0

–

–

ns

Operation recovery time

45

–

–

ns

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