CY14B108L

CY14B108N

Document #: 001-45523 Rev. *I

Page 4 of 24

Table 1. Pin Definitions

Pin Name

I/O Type

Description

Input

Address inputs. Used to select one of the 1,048,576 bytes of the nvSRAM for ×8 configuration.

Address inputs. Used to select one of the 524,288 words of the nvSRAM for ×16 configuration.

Bidirectional data I/O lines for ×16 configuration. Used as input or output lines depending on operation.

WE

Input

Write Enable input, Active LOW. When selected LOW, data on the I/O pins is written to the specific

address location.

CE

Input

Chip Enable input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip.

OE

Input

Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read

cycles. I/O pins are tristated on deasserting OE HIGH.

BHE

Input

BLE

Input

Ground

Ground for the device. Must be connected to the ground of the system.

Power supply Power supply inputs to the device.

HSB

Input/Output Hardware STORE Busy (HSB). When LOW this output indicates that a Hardware STORE is in progress.

When pulled LOW external to the chip it initiates a nonvolatile STORE operation. After each Hardware

current and then a weak internal pull-up resistor keeps this pin HIGH (external pull-up resistor

connection optional).

Power supply AutoStore capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to

nonvolatile elements.

NC

No connect

No connect. This pin is not connected to the die.

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