Chip Inductors ( 15 Page)
Cautions for use
For securing upgraded reliability and safety, consider following caution items.
1. Land pattern design
Refer to the recommended land dimensions of each type at flow and reflow solderings.
Avoid placing the chip inductor on any metal pattern except the land because the drop of Q and mutual
conductance may occur.
Provisions for venting of flux gases should be made for high density assemblies.
Placement force should not exceed 20N because electric and magnetic characteristics change by applying
a Flow soldering
Recommended conditions; 260 ¡C max., 5sec. max.(total time at 2 waves method)
b Reflow soldering
1 Infra-red reflow soldering
Recommended conditions: 200 ¡C or high at electrode, 60sec. max. and peak 250 ¡C max., 5sec. max.
If the solder at the two electrodes are not melt simultaneously, the chip inductor may not be mounted
on the right place.
It is recommended to fix by adhesive when the deviation is great.
2 VPS reflow soldering
Recommended conditions: 215±5 ¡C, 20 to 60sec.
1 Do not use acid or alkari agents. Some cleaning solvents out of CFC may damage the products.
Confirm the reliability in advance.
2 If ultrasonic cleaning is employed, please inform us immediately for technical consultation.
5. Instructions for applying current
The rated current is defined as the smaller value of either the current value when the inductance drops
10 % down from the initial point, or the current value when the average temperature of coil inside rises
20 K up from initial point.
Do not operate this coils beyond the specified rated current.
1 Be careful a high temperature, a large amount of moisture, gases and magnetic field.
2 At long storage of more than 1 year, use the products after inspecting the outer structure
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