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CY62177EV30LL Datasheet(PDF) 1 Page - Cypress Semiconductor |
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CY62177EV30LL Datasheet(HTML) 1 Page - Cypress Semiconductor |
1 / 14 page CY62177EV30 MoBL® 32-Mbit (2 M × 16 / 4 M × 8) Static RAM Cypress Semiconductor Corporation • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document Number: 001-09880 Rev. *G Revised February 22, 2011 32-Mbit (2 M × 16 / 4 M × 8) Static RAM Features ■ Thin small outline package (TSOP) I configurable as 2 M × 16 or as 4 M x 8 static RAM (SRAM) ■ Very high speed ❐ 55 ns ■ Wide voltage range ❐ 2.2 V to 3.7 V ■ Ultra low standby power ❐ Typical standby current: 3 A ❐ Maximum standby current: 25 A ■ Ultra low active power ❐ Typical active current: 4.5 mA at f = 1 MHz ■ Easy memory expansion with CE1, CE2, and OE Features ■ Automatic power down when deselected ■ Complementary Metal Oxide Semiconductor (CMOS) for optimum speed and power ■ Available in Pb-free 48-ball TSOP I package Functional Description The CY62177EV30 is a high performance CMOS static RAM organized as 2 M words by 16 bits and 4 M words by 8 bits[1]. This device features advanced circuit design to provide ultra low active current. It is ideal for providing More Battery Life (MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that significantly reduces power consumption by 99 percent when addresses are not toggling. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when: deselected (CE1HIGH or CE2 LOW), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a write operation (CE1 LOW, CE2 HIGH and WE LOW). To write to the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A20). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written to the location specified on the address pins (A0 through A20). To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory appears on I/O8 to I/O15. See the Truth Table on page 10 for a complete description of read and write modes. Pin #13 of the 48 TSOP I package is an DNU pin that must be left floating at all times to ensure proper application . I/O0–I/O7 A 8 A 7 A 6 A 5 A 2 DATA IN DRIVERS OE A 4 A 3 I/O8–I/O15 WE BLE BHE A 0 A 1 A 9 A10 Power-Down Circuit BHE BLE CE2 CE1 CE2 CE1 BYTE COLUMN DECODER 2M × 16 RAM Array Logic Block Diagram Note 1. For best practice recommendations, refer to the Cypress application note System Design Guidelines. [+] Feedback |
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