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CY62177EV30LL Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY62177EV30LL
Description  32-Mbit (2 M 횞 16 / 4 M 횞 8) Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY62177EV30LL Datasheet(HTML) 1 Page - Cypress Semiconductor

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CY62177EV30 MoBL®
32-Mbit (2 M × 16 / 4 M × 8) Static RAM
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-09880 Rev. *G
Revised February 22, 2011
32-Mbit (2 M × 16 / 4 M × 8) Static RAM
Features
Thin small outline package (TSOP) I configurable as 2 M × 16
or as 4 M x 8 static RAM (SRAM)
Very high speed
55 ns
Wide voltage range
2.2 V to 3.7 V
Ultra low standby power
Typical standby current: 3 A
Maximum standby current: 25 A
Ultra low active power
Typical active current: 4.5 mA at f = 1 MHz
Easy memory expansion with CE1, CE2, and OE Features
Automatic power down when deselected
Complementary Metal Oxide Semiconductor (CMOS) for
optimum speed and power
Available in Pb-free 48-ball TSOP I package
Functional Description
The CY62177EV30 is a high performance CMOS static RAM
organized as 2 M words by 16 bits and 4 M words by 8 bits[1].
This device features advanced circuit design to provide ultra low
active current. It is ideal for providing More Battery Life
(MoBL®) in portable applications such as cellular telephones.
The device also has an automatic power down feature that
significantly reduces power consumption by 99 percent when
addresses are not toggling. The device can also be put into
standby mode when deselected (CE1 HIGH or CE2 LOW or both
BHE and BLE are HIGH). The input and output pins (I/O0 through
I/O15) are placed in a high impedance state when: deselected
(CE1HIGH or CE2 LOW), outputs are disabled (OE HIGH), both
Byte High Enable and Byte Low Enable are disabled (BHE, BLE
HIGH), or during a write operation (CE1 LOW, CE2 HIGH and WE
LOW).
To write to the device, take Chip Enables (CE1 LOW and CE2
HIGH) and Write Enable (WE) input LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0 through
A20). If Byte High Enable (BHE) is LOW, then data from I/O pins
(I/O8 through I/O15) is written to the location specified on the
address pins (A0 through A20). To read from the device, take
Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable
(OE) LOW while forcing the Write Enable (WE) HIGH. If Byte
Low Enable (BLE) is LOW, then data from the memory location
specified by the address pins appear on I/O0 to I/O7. If Byte High
Enable (BHE) is LOW, then data from memory appears on I/O8
to I/O15. See the Truth Table on page 10 for a complete
description of read and write modes.
Pin #13 of the 48 TSOP I package is an DNU pin that must be
left floating at all times to ensure proper application
.
I/O0–I/O7
A 8
A 7
A 6
A 5
A 2
DATA IN DRIVERS
OE
A 4
A 3
I/O8–I/O15
WE
BLE
BHE
A 0
A 1
A 9
A10
Power-Down
Circuit
BHE
BLE
CE2
CE1
CE2
CE1
BYTE
COLUMN DECODER
2M × 16
RAM Array
Logic Block Diagram
Note
1. For best practice recommendations, refer to the Cypress application note System Design Guidelines.
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