Document #: 38-05577 Rev. *C

Page 5 of 12

Capacitance

Parameter[9]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter[9]

Description

Test Conditions

BGA

Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

four-layer printed circuit board

72

C / W

Thermal resistance

(junction to case)

8.86

C / W

Figure 1. AC Test Loads and Waveforms

Parameters

2.50 V

3.0 V

Unit

R1

16667

1103



R2

15385

1554



8000

645



1.20

1.75

V

Parameter

Description

Conditions

Min

Typ[10]

Max

Unit

1

–

–

V

Data retention current

–0.8

3

A

Chip deselect to data retention time

0

–

–

ns

Operation recovery time

45

–

–

ns

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

OUTPUT

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1

Fall time: 1 V/ns

Rise Time: 1 V/ns

Data Retention Waveform

Notes

9. Tested initially and after any design or process changes that may affect these parameters.

10. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25 °C

1.5 V

DATA RETENTION MODE

CE

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