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2N2221A Datasheet(PDF) 5 Page - Microsemi Corporation

Part No. 2N2221A
Description  RADIATION HARDENED
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Maker  MICROSEMI [Microsemi Corporation]
Homepage  http://www.microsemi.com
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TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0042 Rev. 3 (100247)
Page 5 of 7
NOTES:
Dimensions
1. Dimensions are in inches.
Symbol
Inches
Millimeters
Note
2. Millimeters are given for general information only.
Min
Max
Min
Max
3. Dimension CH controls the overall package thickness. When a
BL
.215
.225
5.46
5.71
window lid is used, dimension CH must increase by a minimum of
BL2
.225
5.71
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
BW
.145
.155
3.68
3.93
4. The corner shape (square, notch, radius) may vary at the
BW2
.155
3.93
manufacturer's option, from that shown on the drawing.
CH
.061
.075
1.55
1.90
3
5. Dimensions LW2 minimum and L3 minimum and the appropriate
L3
.003
.007
0.08
0.18
5
castellation length define an unobstructed three-dimensional space
LH
.029
.042
0.74
1.07
traversing all of the ceramic layers in which a castellation was
LL1
.032
.048
0.81
1.22
designed. (Castellations are required on the bottom two layers,
LL2
.072
.088
1.83
2.23
optional on the top ceramic layer.) Dimension LW2 maximum and
LS
.045
.055
1.14
1.39
L3 maximum define the maximum width and depth of the
LW
.022
.028
0.56
0.71
castellation at any point on its surface. Measurement of these
LW2
.006
.022
0.15
0.56
5
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for
Pin no.
1
2
3
4
solder dipped leadless chip carriers.
Transistor
Collector
Emitter
Base
N/C
7. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 2. Physical dimensions, surface mount (UA version).




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