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MAX9259 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX9259 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 51 page Gigabit Multimedia Serial Link with Spread Spectrum and Full-Duplex Control Channel 2 ______________________________________________________________________________________ Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AVDD to AGND MAX9259...........................................................-0.5V to +1.9V MAX9260...........................................................-0.5V to +3.9V DVDD to GND (MAX9259) ...................................-0.5V to +1.9V DVDD to DGND (MAX9260).................................-0.5V to +3.9V IOVDD to GND (MAX9259) ..................................-0.5V to +3.9V IOVDD to IOGND (MAX9260) ..............................-0.5V to +3.9V Any Ground to Any Ground .................................-0.5V to +0.5V OUT+, OUT- to AGND (MAX9259) ......................-0.5V to +1.9V IN+, IN- to AGND (MAX9260) ..............................-0.5V to +1.9V LMN_ to GND (MAX9259) (60kI source impedance)................................-0.5V to +3.9V All Other Pins to GND (MAX9259) ....... -0.5V to (IOVDD + 0.5V) All Other Pins to IOGND (MAX9260) ... -0.5V to (IOVDD + 0.5V) OUT+, OUT- Short Circuit to Ground or Supply (MAX9259).................................................Continuous IN+, IN- Short Circuit to Ground or Supply (MAX9260).................................................Continuous Continuous Power Dissipation (TA = +70NC) 64-Pin TQFP (derate 31.3mW/NC above +70NC) .......2508mW 56-Pin TQFN (derate 47.6mW/NC above +70NC)....3809.5mW ESD Protection Human Body Model (RD = 1.5kI, CS = 100pF) (OUT+, OUT-) to AGND (MAX9259) ............................Q8kV (IN+, IN-) to AGND (MAX9260) ....................................Q8kV All Other Pins to Any Ground (MAX9259) ....................Q4kV All Other Pins to Any Ground (MAX9260) ....................Q4kV IEC 61000-4-2 (RD = 330I, CS = 150pF) Contact Discharge (OUT+, OUT-) to AGND (MAX9259) ..........................Q10kV (IN+, IN-) to AGND (MAX9260) ....................................Q8kV Air Discharge (OUT+, OUT-) to AGND (MAX9259) ..........................Q12kV (IN+, IN-) to AGND (MAX9260) ..................................Q10kV ISO 10605 (RD = 2kI, CS = 330pF) Contact Discharge (OUT+, OUT-) to AGND (MAX9259) ..........................Q10kV (IN+, IN-) to AGND (MAX9260) ....................................Q8kV Air Discharge (OUT+, OUT-) to AGND (MAX9259) ..........................Q25kV (IN+, IN-) to AGND (MAX9260) ..................................Q20kV Operating Temperature Range........................ -40NC to +105NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC MAX9259 DC ELECTRICAL CHARACTERISTICS (VDVDD = VAVDD = 1.7V to 1.9V, VIOVDD = 1.7V to 3.6V, RL = 100I Q1% (differential), TA = -40NC to +105NC, unless otherwise noted. Typical values are at VDVDD = VAVDD = VIOVDD = 1.8V, TA = +25NC.) ABSOLUTE MAXIMUM RATINGS 64 TQFP Junction-to-Ambient Thermal Resistance (BJA) .......31.9NC/W Junction-to-Case Thermal Resistance (BJC) .................1NC/W 56 TQFN Junction-to-Ambient Thermal Resistance (BJA) ..........21NC/W Junction-to-Case Thermal Resistance (BJC) .................1NC/W PACKAGE THERMAL CHARACTERISTICS (Note 1) Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SINGLE-ENDED INPUTS (DIN_, PCLKIN, PWDN, SSEN, BWS, ES, DRS, MS, CDS, AUTOS, SD, SCK, WS) High-Level Input Voltage VIH1 0.65 x VIOVDD V Low-Level Input Voltage VIL1 0.35 x VIOVDD V Input Current IIN1 VIN = 0 to VIOVDD -10 +10 F A Input Clamp Voltage VCL ICL = -18mA -1.5 V SINGLE-ENDED OUTPUT (INT) High-Level Output Voltage VOH1 IOH = -2mA VIOVDD - 0.2 V Low-Level Output Voltage VOL1 IOL = 2mA 0.2 V Output Short-Circuit Current IOS VO = 0V VIOVDD = 3.0V to 3.6V 16 35 64 mA VIOVDD = 1.7V to 1.9V 3 12 21 |
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