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QBVW033A0B541Z Datasheet(PDF) 10 Page - Lineage Power Corporation |
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QBVW033A0B541Z Datasheet(HTML) 10 Page - Lineage Power Corporation |
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10 / 15 page  Preliminary Data Sheet January 21, 2011 QBVW033A0B Series Power Modules; DC-DC Converters 36-75Vdc Input; 12Vdc Output; 33A Output Current LINEAGE POWER 10 LOCAL AMBIENT TEMPERATURE, TA (C) Figure 21. Output Current Derating for the Base plate QBVW033A0B-H with 1.0” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. Layout Considerations The QBVW033 power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. For additional layout guide-lines, refer to FLTR100V10 Data Sheet. Through-Hole Lead-Free Soldering Information The RoHS-compliant, Z version, through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. The module is designed to be processed through single or dual wave soldering machines. The pins have a RoHS- compliant, pure tin finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210 C. For Pb solder, the recommended pot temperature is 260 C, while the Pb-free solder pot is 270 C max. Reflow Lead-Free Soldering Information The RoHS-compliant through-hole products can be processed with TBD paste-through-hole Pb or Pb-free reflow process. Process details TB If additional information is needed, please consult with your Lineage Power representative for more details. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS). LOCAL AMBIENT TEMPERATURE, TA (C) Figure 19. Output Current Derating for the Base plate QBVW033A0B-H with 0.25” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. LOCAL AMBIENT TEMPERATURE, TA (C) Figure 20. Output Current Derating for the Base plate QBVW033A0B-H with 0.5” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. |
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