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ZXMN10A07F Datasheet(PDF) 2 Page - Diodes Incorporated |
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ZXMN10A07F Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 7 page ZXMN10A07F SEMICO NDUC TORS ISSUE 5 - JULY 2003 2 PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDSS 100 V Gate-Source Voltage VGS 20 V Continuous Drain Current @ VGS=10V; TA=25°C (b) @VGS=10V; TA=70°C (b) @VGS=10V; TA=25°C (a) ID 0.8 0.6 0.7 A Pulsed Drain Current (c) IDM 3.5 A Continuous Source Current (Body Diode) (b) IS 0.5 A Pulsed Source Current (Body Diode) (c) ISM 3.5 A Power Dissipation at TA=25°C (a) Linear Derating Factor PD 625 5 mW mW/°C Power Dissipation at TA=25°C (b) Linear Derating Factor PD 806 6.4 mW mW/°C Operating and Storage Temperature Range Tj;Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) R JA 200 °C/W Junction to Ambient (b) R JA 155 °C/W THERMAL RESISTANCE NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 5 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. |
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