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SY58040UMITR Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SY58040UMITR Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 12 page 4 SY58040U Micrel, Inc. M9999-103009 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Power Supply Voltage (VCC ) .......................–0.5V to +4.0V Input Voltage (VIN)...........................................–0.5V to VCC CML Output Voltage (VOUT) ..........VCC –0.5V to VCC +5.0V Termination Current(3) Source or sink current on VT pin ........................ ±100mA Input Current(3) Source or sink current on IN, /IN .......................... ±50mA VREF-AC Current(3) Source or sink current on IN, /IN ............................ ±2mA Lead Temperature (soldering, 20 sec.)...................... 260°C Storage Temperature Range (TS )............ –65°C to +150°C Operating Ratings(2) Power Supply Voltage (VCC) ................. +2.375V to +3.60V Ambient Temperature Range (TA) .............. –40°C to +85°C Package Thermal Resistance(4) MLF® (θJA) Still-Air ............................................................. 23°C/W MLF® (ψJB) Junction-to-board............................................. 12°C/W Symbol Parameter Condition Min Typ Max Units VCC Power Supply Voltage VCC = 2.5V. 2.375 2.5 2.625 V VCC = 3.3V. 3.0 3.3 3.6 V ICC Power Supply Current No load, max. VCC. 225 300 mA Includes current from internal 50Ω pull-up on each output. RIN Input Resistance (IN-to-VT, /IN-to-VT) 45 50 55 Ω RDIFF_IN Differential Input Resistance 90 100 110 Ω (IN-to-/IN) VIH Input HIGH Voltage Note6 VCC–1.6 VCC V (IN-to-/IN) VIL Input LOW Voltage 0 VIH–0.1 V (IN-to-/IN) VIN Input Voltage Swing See Figure 1a. 0.1 1.7 V (IN-to-/IN) VDIFF_IN Differential Input Voltage Swing See Figure 1b. 0.2 V |IN – /IN| VT_IN IN to VT (IN-to-/IN) 1.28 V VREF-AC Output Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V Notes: 1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. θJA uses 4-layer in still-air number, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIH (min) not lower than 1.2V. DC ELECTRICAL CHARACTERISTICS(5) TA= –40°C to +85°C, unless otherwise stated. |
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