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Document Number: 20046

3

Revision: 04-Mar-10

RCL e3

Vishay

Long Side Termination Thick Film Chip Resistors

FUNCTIONAL PERFORMANCE

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

ΔR)

STABILITY CLASS 2 OR BETTER

Stability for product types:

RCL e3

1

Ω to 1 MΩ

4.5

-

Resistance

-

± 1 %

± 5 %

4.7

-

Voltage proof

No flashover or breakdown

4.13

-

Short time overload

U = 2.5 x

Duration acc. to style

±

(0.25 % R + 0.05 Ω)± (0.5 % R + 0.05 Ω)

4.17.2

58 (Td)

Solderability

Solder bath method;

Sn60Pb40

non activated flux;

(235 ± 5) °C

(2 ± 0.2) s

Good tinning (

≥ 95 % covered);

no visible damage

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 ± 5)

°C

(3 ± 0.3) s

Good tinning (

≥ 95 % covered);

no visible damage

4.8.4.2

-

Temperature

coefficient

(20/- 55/20)

°C and

(20/125/20)

°C

± 100 ppm/K

± 200 ppm/K

4.32

Shear

(adhesion)

45N

No visible damage

4.33

Substrate bending

Depth 2 mm;

3 times

No visible damage, no open circuit in bent position

± (0.25 %

R + 0.05

Ω)

4.19

14 (Na)

Rapid change of

temperature

30 min at - 55 °C;

30 min at 125 °C

5 cycles

± (0.25 %

R + 0.05

Ω)

± (0.5 %

R + 0.05

Ω)

1000 cycles

± (1 %

R + 0.05

Ω)± (1 % R + 0.05 Ω)

- 55

- 25

0

25

50

75

100

125

155 175

120

100

80

60

40

20

0

70

Derating

Ambient Temperature in °C

P