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CC2540F128RHAR Datasheet(PDF) 3 Page - Texas Instruments |
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CC2540F128RHAR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 33 page CC2540F128, CC2540F256 www.ti.com SWRS084 – OCTOBER 2010 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) MIN MAX UNIT Supply voltage All supply pins must have the same voltage –0.3 3.9 V –0.3 VDD + 0.3, Voltage on any digital pin V ≤ 3.9 Input RF level 10 dBm Storage temperature range –40 85 °C All pads, according to human-body model, JEDEC STD 22, method 2 kV A114 ESD(2) According to charged-device model, JEDEC STD 22, method C101 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Operating ambient temperature range, TA –40 85 °C Operating supply voltage 2 3.6 V ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD 235 and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and µA 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and 0.9 Icore Core current consumption sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; 0.4 RAM and register retention Low MCU activity: 32-MHz XOSC running. No radio or 6.7 mA peripherals. No flash access, no RAM access. Timer 1. Timer running, 32-MHz XOSC used 90 mA Timer 2. Timer running, 32-MHz XOSC used 90 mA Peripheral current consumption Timer 3. Timer running, 32-MHz XOSC used 60 mA Iperi (Adds to core current Icore for each Timer 4. Timer running, 32-MHz XOSC used 70 mA peripheral unit activated) Sleep timer, including 32.753-kHz RCOSC 0.6 mA ADC, when converting 1.2 mA Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): CC2540F128 CC2540F256 |
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