MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2

1 of 5

www.diodes.com

April 2009

© Diodes Incorporated

MMBZ5221BW - MMBZ5259BW

200mW SURFACE MOUNT ZENER DIODE

Features

•

Planar Die Construction

•

Ultra-Small Surface Mount Package

•

General Purpose

•

Ideally Suited for Automated Assembly Processes

•

Lead Free/RoHS Compliant (Note 2)

•

Qualified to AEC-Q101 Standards for High Reliability

•

"Green" Device (Notes 3 and 4)

Mechanical Data

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Case: SOT-323

•

Case Material: Molded Plastic, "Green" Molding Compound

(Note 4). UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Polarity: See Diagram

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Marking Information: See Page 3

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Ordering Information: See Page 3

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Weight: 0.006 grams (approximate)

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1)

200

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

625

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date

code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Top View

Device Schematic

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