BZX84C2V4W - BZX84C39W

200mW SURFACE MOUNT ZENER DIODE

Features

•

Planar Die Construction

•

200mW Power Dissipation

•

Zener Voltages from 2.4V – 39V

•

Ultra-Small Surface Mount Package

•

Lead Free/RoHS Compliant (Note 4)

•

"Green" Device (Notes 1 and 2)

Mechanical Data

•

Case: SOT-323

•

Case Material: Molded Plastic, "Green" Molding Compound,

Note 2. UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Polarity: See Diagram

•

Marking Information: See Page 3

•

Ordering Information: See Page 3

•

Weight: 0.006 grams (approximate)

Top View

Device Schematic

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 3)

200

mW

Thermal Resistance, Junction to Ambient Air (Note 3)

625

K/W

Operating and Storage Temperature Range

-65 to +125

°C

Notes:

1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.

2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

4. No purposefully added lead.

BZX84C2V4W - BZX84C39W

Document number: DS30066 Rev. 15 - 2

1 of 4

www.diodes.com

May 2008

© Diodes Incorporated

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