MMSZ5221B - MMSZ5259B

Document number: DS18010 Rev. 23 - 2

1 of 5

www.diodes.com

May 2009

© Diodes Incorporated

MMSZ5221B - MMSZ5259B

500mW SURFACE MOUNT ZENER DIODE

Features

•

500mW Power Dissipation

•

General Purpose, Medium Current

•

Ideally Suited for Automated Assembly Processes

•

Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)

•

"Green" Device (Note 4)

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

•

Case: SOD-123

•

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Polarity: Cathode Band

•

Ordering Information: See Page 3

•

Marking Information: See Page 3

•

Weight: 0.01 grams (approximate)

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

500

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

350

°C/W

Thermal Resistance, Junction to Lead (Note 2)

150

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.

2. Thermal Resistance measurement obtained via infrared scan method.

3. No purposefully added lead. Halogen and Antimony Free.

4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date

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